Inspection

Solder paste inspection is the first serious quality gate in SMT assembly. This guide explains what SPI catches before reflow, which limits buyers should define, and how to use SPI data alongside AOI, X-ray, stencil control, and functional test.

First article inspection is where PCB assembly buyers either lock process discipline early or approve volume production with blind spots that become expensive later. This guide explains what a useful first article inspection should include, what evidence buyers should review, and how to avoid treating FAI as a cosmetic formality.

X-ray inspection is one of the most useful controls for hidden solder joints in PCB assembly, but many buyers request it too vaguely or expect it to prove more than it can. This guide explains when X-ray matters, what defects it can reveal, and what release evidence buyers should verify before approving production.

AOI inspection is one of the most common quality gates in PCB assembly, but many buyers misunderstand what automated optical inspection can actually verify. This guide explains where AOI adds value, which defects it catches well, where it fails, and how to combine it with SPI, X-ray, ICT, and functional test for lower escape risk.