Compare features, costs, and applications of different PCB surface finishes.
| Finish | Cost | Shelf Life | Flatness | Fine Pitch | Lead-Free | Reworkable | Wire Bond |
|---|---|---|---|---|---|---|---|
| HASL (Leaded) | $ | 12+ months | Poor | ||||
| Lead-Free HASL | $ | 12+ months | Poor | ||||
| ENIG | $$$ | 12+ months | Excellent | ||||
| OSP | $ | 3-6 months | Excellent | ||||
| Immersion Silver | $$ | 6-12 months | Excellent | ||||
| Immersion Tin | $$ | 3-6 months | Excellent | ||||
| Hard Gold | $$$$ | 12+ months | Good |
Hot Air Solder Leveling (Leaded)
Hot Air Solder Leveling (Lead-Free)
Electroless Nickel Immersion Gold
Organic Solderability Preservative
Immersion Silver (IAg)
Immersion Tin (ISn)
Electrolytic Hard Gold