{"id":3041,"date":"2023-03-16T09:18:21","date_gmt":"2023-03-16T09:18:21","guid":{"rendered":"https:\/\/yourpcb.com\/?p=3041"},"modified":"2023-03-16T10:21:58","modified_gmt":"2023-03-16T10:21:58","slug":"bga-ball-grid-array","status":"publish","type":"post","link":"https:\/\/yourpcb.com\/bga-ball-grid-array\/","title":{"rendered":"BGA Ball Grid Array: Everything You Need to Know"},"content":{"rendered":"\n
BGA Ball Grid Array has increasingly become an integral element of SMD ICs needing high-density connections. <\/p>\n\n\n\n
After all, BGA simplifies the process of making integrated circuits by allowing you to use the underside of a chip package for connectivity. <\/p>\n\n\n\n
And doing so helps you reduce connection density more than you would with connections around the edge, simplifying your PCB layout. <\/p>\n\n\n\n
This guide offers a detailed analysis of what you need to know about the BGA ball grid array. <\/p>\n\n\n
A frequently asked question is why BGA is stealing the show in the wake of modern technology. <\/p>\n\n\n\n
Well, there are several reasons. <\/p>\n\n\n\n
But primarily, unlike BGA, the conventional style packages with their thin and closely spaced pins had some issues, including:<\/p>\n\n\n
QFPS pins are naturally thin, and the minimal spacing increases the need for controlling the pins closely. <\/p>\n\n\n\n
Any mishandling or hitches can result in an almost permanent displacement that could damage the pins. <\/p>\n\n\n\n
Because ICs rely on expensive pin counts, making any resultant damages a significant issue. <\/p>\n\n\n
From the designer’s viewpoint or perspective, the nature of the pin density does not allow for taking tracks from the IC. Doing so could create congestion in some areas. <\/p>\n\n\n\n
However, BGA helps overcome this issue and enjoy flawless connectivity. <\/p>\n\n\n